Xperi is a new entity with a complicated back-story, but a pretty cool vision for its future. First, there was...
Chalk up another industry first for Tezzaron Semiconductor, who announced just today (or tomorrow, if you are there for the excitement at IEEE...
SAN JOSE, CA (August 28) — Tessera Technologies, Inc. announced the acquisition of Ziptronix, Inc. for $39 million in cash....
CMOS image sensors (CIS) have often been heralded as the first 3D devices in volume manufacturing. However, this is not really...
Permanent wafer bonding can be categorized based on bonding with or without an intermediate layer. Intermediate layers can be subcategorized...
It may have been a coincidence that at last week’s 3D ASIP Conference, Invensas, Tezzaron/Novati, and Ziptronix booths were lined...
Micron’s recent announcement that they will be shipping samples of the Hybrid Memory Cube (HMC) and ramping to production in...
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. Sitting down with...
Product Description Copper DBI® technology is a patented low cost, scalable process technology that was licensed for 3D memory assemblies...
While most of the semiconductor trade publications wrapped up their 2013 prediction posts by mid January, Semiconductor Packaging News (SPN) forged...
There's no place like SEMICON West for a company to make a major announcement. After all, it is the semiconductor...
After seeing the latest press release on Ziptronix foray into the memory space, I sought out Kathy Cook, business development...
Ever since I got involved in the world of advanced packaging, and particularly 3D, I’ve had a soft spot for...
Paul Enquist, Ziptronix Inc.’s chief technology officer and vice president of R&D, will provide an update on direct bond technology...
