TEMPE, Ariz., February 23, 2021 ― Amkor Technology, Inc. (Nasdaq: AMKR), a leader in advanced packaging technologies that support high-growth...
The semiconductor industry showed impressive figures in 2017: +21.6% year-over-year growth to reach about US$ 412 billion. Without any doubt,...
The overall semiconductor equipment market is today worth several billion dollars. By contrast, the permanent bonding, temporary bonding and debonding...
“Fan-out packaging is now a must-have in the portfolio to stay competitive,” asserts Favier Shoo, Technology & Market Analyst and...
“Automotive applications are the new El Dorado for microelectronics,” announces Emilie Jolivet, Director, Semiconductor & Software at Yole Développement (Yole)....
Winter 2018, and Korea is at the center of the world in both sports and in electronics. Sports, of course,...
The memory industry is experiencing a strong growth phase: the total memory market is expected to increase at a ~9%...
According to Yole Développement (Yole), the MEMS packaging market will grow from US$2.56 billion in 2016 to US$6.46 billion in...
Used either as a permanent or as a temporary material within the semiconductor manufacturing processes, glass plays a key role...
“Advanced substrates are the key interconnect component of advanced packaging architectures,” comments Andrej Ivankovic, Technology & Market Analyst, Advanced Packaging...
2016 was the year of strong consolidations in the semiconductor industry. Yole Développement (Yole) highlights many mergers and acquisitions with...
Fan-in packaging has been a successful and steadily growing platform for over a decade. However, fan-in packaging should face a...
In 2015, more than US$1 billion was invested in China’s advanced packaging ecosystem, announces Yole Développement (Yole) in its report...
Each year, Apple integrates more and more innovative technologies in its iPhone products. This year, with the new iPhone 7...
System Plus Consulting announces the release in the next few weeks of a complete report on TSMC’s Integrated Fan-Out (inFO) technology...
I’ve had an epiphany regarding fan-out wafer level packaging (FOWLP). Epiphany: “A usually sudden manifestation or perception of the essential...
Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced...
To overcome the current market and technology constraints taking place today within the semiconductor industry, new advanced packaging technologies have...
Over the past few years, it becomes clear that some panel-level packaging choices will be more suitable than others for...
The mobile sector is driving production and market growth; however a new market driver, the Internet of Things (IoT) is on...
