I first started covering Ziptronix and its hybrid bonding technology back in 2007 when I was writing Perspectives from the...
Actually, 3D System integration takes more than a village. It takes a global effort. As Virtual ECTC 2020 continues this...
Invensas direct and hybrid bonding technologies licensed by Tower Semiconductor to further enhance its outstanding pixel performance and significant competitive...
Last year at ECTC 2019, Xperi officially launched DBI Ultra™; the die-to-wafer hybrid bonding version of the highly successful, wafer-to-wafer...
The expansion of hybrid bonding as a process for high-density packaging was the topic of some presentations presented at the...
The monthly MEPTEC Luncheons at SEMI in Milpitas focus on microelectronics packaging and test topics. Javier DeLaCruz, Xperi’s VP of...
Hybrid bonding is quickly becoming recognized as the preferred permanent bonding path for forming high-density interconnects in heterogeneous integration applications,...
We are pleased to announce the winners of the 2018 3D InCites Awards, sponsored by KLA-Tencor and EV Group and...
Xperi is a new entity with a complicated back-story, but a pretty cool vision for its future. First, there was...
Semiconductor Manufacturing International Corporation, one of the leading semiconductor foundries in the world and the largest and most advanced foundry...
As part of the organizing committee, we believe this year’s IMAPS Device Packaging Conference really fulfilled what the announcement promised...
Semiconductor device fabrication and packaging is rife with acronyms, and by my estimate, the Top 3 trafficked by speakers at...
