I don’t know why it still surprises me to read conflicting reports on the progress of 3D TSVs. But I...
The blanket silicon etch process performed on the SPTS Rapier XE achieves an etch rate >8.5µm/min, high selectivity (Si:SiO>150:1), and is...
SSEC’s WaferEtch™ TSV Revealer is a single wafer wet processing platform for 3D IC and interposer wet etching applications designed...
Newport, United Kingdom, 22 May, 2014 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor...
Customers have asked and suppliers are listening. One sign of progress from last year to this year at SEMICON Singapore’s...
In 2013, SPTS equipment sales into the advanced packaging market grew by 75%. Some of this was due to a...
Unique Configurations Bring Improved Process Control, Lower CoO, and Higher Throughput to Pave the Way for Leading-Edge Technology Adoption Horsham,...
Now that the “technology bricks” for building 2.5D devices and 3D ICs have been essentially qualified, the focus has turned...
