Latest Posts - Page 2
EDA Tool Addresses 3D Design Limitations
One by one, it looks like to-do items are being checked off the list of TSV adoption limitations for 3D...Talking the 3D Talk
I was happy to share the 3D stage as a contributing editor in this week’s issue of AP Semi-monthly....Bluebird: A project in 3D Equipment Development
I consider myself to be fairly savvy when it comes to knowing who the players are in 3D IC technology...SEMICON Europa 2012 Focuses on Materials, 3D ICs, and 450mm
SEMICON Europa got underway yesterday, and reports from the event point to new materials, 450mm and 3D ICs as the...2.5D and 3D Messages Worth Repeating
I listened in on yesterday’s webcast, 3D and 2.5D Integration: A Status Report Live Event hosted by Solid State Technology,...Alchimer Discloses Major TSV Barrier Film Advance
A new film-deposition technology advance from Alchimer S.A.is said to cut fill deposition times and could provide new options for...Cascade Microtech Partners With imec for 3D-TSV Probe Solutions
Semiconductor test manufacturer, Cascade Microtech, Inc. and imec have entered into a collaborative research partnership for testing and characterization of...Jim Walker’s Crystal Ball
Ok, maybe I should say Gartner’s crystal ball, but whenever Jim Walker delivers a presentation based on Gartner research, he...Alchimer opens 300mm facility in Asia
Alchimer announced the opening of a new applications-and-development facility in Seoul, South Korea, for...
TSVs: Emerging No Longer
What makes something an emerging technology, and what makes it near-term? I asked this question of the IEDM technical committee...Alchimer Introduces Via Fill Technology
Alchimer S.A. has announced a groundbreaking advanced technology for filling narrow, high-aspect-ratio TSVs while significantly reducing...CEA-Leti and SPTS to Collaborate On Next-Generation TSV Development
CEA-Leti and SPP Process Technology Systems (SPTS) have agreed to develop advanced 300mm through-silicon via (TSV) 3D-IC processes at CEA-Leti’s...Who Invented the Through Silicon Via (TSV) and When?
In this post written and submitted by John H. Lau, Electronics & Optoelectronics Laboratory, ITRI, the true inventor of...
Alchimer signs far-reaching agreement with KPM Tech
In a deal that is expected to generate economical new process options for the 3D integration market,3D Discussion Topics: Looking for Member Input
I’ve been waging a campaign this week to bring in new members by contacting all the members of the...
Successful 3D Integration takes more than new technologies
In last week’s discussions in the design space — Is TSV a...
