Since it first appeared several years ago, IFTLE has been a big-time proponent of pre-applied non-conductive film (NCF) combined with...
The industry standard interconnect technology for fine-pitch 2.5D assembly and 3D stacking is thermocompression bonding of solder capped μbumps. This...
It’s been a long time coming, but Kulicke & Soffa has seen the writing on the wall, and it reads:...
An excerpt from the Semiconductor Assembly Blog by Andy C. Mackie, Global Product Manager for Indium Corporation's Semiconductor and Advanced...
