In electronic product design, solely relying on process shrink as the primary driver of product innovation and improved system performance...
Thermal problems in semiconductor electronic systems often go unnoticed and cause failures. Although thermal problems can be understood and avoided...
Technology innovations don’t reach customers right away. Since 1980 I have observed how our industry has improved key parameters like...
Santa Clara’s Convention Center was home to DesignCon 2019 from January 29-31, 2019. This conference is well known for showing...
And what are we going to do about it in 2015…? A moment ago I finished reading my predictions for...
Earlier this year, I published an open letter to chip and system-level designers regarding 3D integration, suggesting they consider 3D...
Ever since SEMICON West 2014, I’ve been seeing a lot of coverage of the 2.5D and 3D adoption question on...
