Permanent wafer bonding can be categorized based on bonding with or without an intermediate layer. Intermediate layers can be subcategorized...
SUSS MicroTec announced the installation of its ELP300 excimer laser stepper to support next-generation advanced packaging and 3D IC laser...
The semiconductor industry’s march toward broader 3D IC integration marked an important milestone this week at the 2013 Electronic Components...
The good news: While forecasted dates for 3D IC volume manufacturing continues to be pushed out, clearly foundries and OSATS are...
Now that the “technology bricks” for building 2.5D devices and 3D ICs have been essentially qualified, the focus has turned...
I have to admit that this year at IMAPS Device Packaging Conference, I spent more time attending technical sessions and...
In last week’s email update, I talked about the pendulum starting to swing back the other way, albeit ever so...
It’s only Tuesday, and already, it’s been a productive week for 3D news.
Brewer Science, Inc., the inventor of ZoneBOND™ technology and world leading expert in materials and processes for thin wafer handling,...
SUSS MicroTec has appointed Dr Rainer Knippelmeyer as VP R&D and CTO. In this function Rainer Knippelmeyer will oversee research...
