October 2024 member news was marked by significant developments and milestones. From the grand openings of cutting-edge facilities that enhance...
As summer holidays came to a close, September found our member companies ramping up new products and opening new facilities....
August has been a thrilling month for the semiconductor industry, marked by notable achievements from our community members. From innovative...
IMAPS 20th Annual Device Packaging Conference – Event Highlights The International Microelectronics Assembly and Packaging Society (IMAPS) 20th annual Device...
The 3D InCites community members continue to create a buzz with announcements from new acquisitions to industry awards, new product...
Santee, Calif. – 30 November 2023 –StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for RF,...
At the 2023 IMAPS Symposium in October, I had some great community member conversations about some of the hot topics...
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This...
Santee, Calif. – 14 September 2023 –StratEdge Corporation will present its thermally-efficient line of post-fired and molded ceramic semiconductor packages at...
Santee, Calif. – 22 August 2023 – StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for RF,...
Our 3D InCites Community Members had an abundant amount of news to share this month, so we thought we should...
Santee, Calif. – 7 June 2023 – StratEdge Corporation, a leader in the design and production of high-performance semiconductor packages for microwave,...
Santee, Calif. – 14 April 2023 – StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages...
Santee, Calif. — StratEdge Corporation,leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and...
The 19th Annual Device Packaging Conference (DPC 2023) is scheduled for next week, March 13-16, 2023, at the WeKoPa Conference...
Santee, Calif. — StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF,...
Santee, Calif. — 17 November 2022 — StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power...
One of the things I love most about being part of the International Microelectronics and Packaging Society (IMAPS) is the...
Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth...
Technical experts available at BCICTS 2022 and IMAPS 2022 to discuss packaging applications Santee, Calif. — 28 September 2022 — StratEdge Corporation, leader...
