Apps natively integrated with the Xcelium Logic Simulator enable users to target domain-specific needs for highest verification performance SAN JOSE,...
We have known for some time that with scaling coming to an end the industry would need to find another...
Once a month, MEPTEC, now managed by Ira Feldman, organizes a very informative luncheon at SEMI in Milpitas. On November...
The growing digitalization of our society has made our lives connected and, in many aspects, easier. But the digital revolution...
Many high-performance systems today use custom ASICs or SoCs to provide the necessary computational power and data bandwidth demanded by...
Several years before I started promoting 3D IC benefits in 2008, a small team of industry visionaries founded the 3D...
Multichip module (MCM), system-in-package (SiP), system-on-chip (SoC), and heterogeneous integration are all important semiconductor packaging technologies. They deserve to have, at...
It’s 2017, and system-on-a-chip (SoC) is headed for a dielet. At least that’s my 2017 outlook, based on takeaways from...
Dear Chip and System-level Designers, Allow me to introduce myself. My name is Françoise von Trapp, and I am known...
Due to schedule conflicts, I was unable to attend this year’s Silicon Summit, which took place April 10, 2014 at...
The Friday 3D Integration Workshop at DATE 2014 once again found me among friends, as an intimate group of about...
GLOBALFOUNDRIES has unveiled details of a 2.5D test vehicle project that demonstrates the value of its open and collaborative approach...
What is today’s biggest threat to continued growth in the semiconductor industry? Subramani Kengeri, Vice President, Advanced Technology Architecture, GLOBALFOUNDRIES,...
