Latest Posts
Novati Technologies: Silicon Interposer Module
The 2.5D Interposer Module features three front-side interconnect layers of dual-damascene copper on top of a single-damascene copper metal layer,...
Automatic Wafer Metrology: Applying X-ray Technology in the 3D Space
The way I see it, it was only a matter of time before Nordson DAGE brought its X-ray technology into...
Motivation for 3D IC and other Key Take-Aways from the IEEE 3D IC Conference
The IEEE 3D Systems Integration Conference (IEEE 3D IC) is a unique event that is a truly international effort in assembling all...
More than Moore and 3D IC: Decoding the Code at the GSA Silicon Summit 2013
There’s probably no more fitting venue for discussing future directions for processing and packaging technology in integrated circuit fabrication than...
Fraunhofer IZM Update with M. Juergen Wolf
I’ve been on a mission to interview the directors of all three European microelectronics research centers that are participating in...Catching up with imec’s Eric Beyne
Eric Beyne (imec) and I go way back. He’s the Scientific Director of Advanced Packaging Technologies at imec, and ever...The Flip Side of the Glass Interposer Coin
We’ve been hearing and reading a lot about work being done at Georgia Tech’s PRC in developing glass interposer technologies...Glass vs. Silicon Interposers for 2.5D and 3D IC Applications
There has been enough interest stirred up in R&D around glass as a low-cost alternative interposer substrate material compared with...A*STAR Institute of Microelectronics and Tezzaron Team Up to Develop 2.5D/3D Through-Silicon Interposer Technology
The A*STAR Institute of Microelectronics (IME) and Tezzaron Semiconductor, a leader in 3D-ICs, have today announced a research collaboration agreement...
Alchimer’s Technology Breakthrough Brings Tomorrow’s Solutions to Today’s Applications
Alchimer’s latest technology breakthrough is an interesting twist on the way semiconductor solutions generally presents themselves. We’re used to hearing...Alchimer Product Extension Provides Metallization For Interposer and Via Last in 3D Packaging
Alchimer, provider of nanometric film deposition for advanced 3D packaging applications as well as semiconductor interconnects, MEMS and other electronic...CEA-Leti and SHINKO Sign Common-Lab Agreement
In a move that promises to provide increased performance and smaller size for portable electronics and other advanced systems, CEA-Leti...Elephants, Bunnies, and Sandwiches: A Few Favorite Things from the GSA Memory Conference
Symbolism and analogies were flying fast and furious yesterday at the GSA Memory Conference in San Jose, CA. which addressed...3D Panel tackles the TSV test conundrum….and some other things
Whether you’re a believer or a skeptic, there’s no arguing that discussions on 3D continue to draw a crowd....
3D R&D Round-up: Part 1: RTI International
At last month’s 3D Architectures for Semiconductor Integration and Packaging Conference, coordinated by RTI International, three government-funded research institutes...
