San Jose, California – USA – The International Wafer-Level Packaging Conference and Expo announces Dan Oh, Ph.D., Engineering VP of...
Heterogeneous Integration spurs demand for 3D backend solutions Julian Ho reported in the Jan 10th issue of Digitimes that heterogeneous integration...
As its name implies, the International Wafer Level Packaging Conference (IWLPC) initially covered wafer-level packaging (WLP) technologies. As all conferences...
Samsung at the Leading Edge At the recent Samsung Tech Day, the company unveiled several new technologies: Their 7nm extreme ultraviolet...
The Winter Games are over and the athletes returned home, and the SEMICON Korea 2018 teams from February have their...
Winter 2018, and Korea is at the center of the world in both sports and in electronics. Sports, of course,...
San Francisco’s Moscone Center (above), the traditional home of SEMICON West trade shows, is undergoing major reconstruction work. Looking at...
I’ve had an epiphany regarding fan-out wafer level packaging (FOWLP). Epiphany: “A usually sudden manifestation or perception of the essential...
“On average since 1885, the yearly height record has gone up by 10 feet (3 meters) each time. Since the...
The 3D NAND floodgates just opened a little wider with today’s announcement from BeSang that it has developed 3D Super-NAND...
In July and August schools are closed and many people like to take vacation. Typically nothing major happens during these...
All the hype surrounding the Internet of Things has me worried. First of all, its my opinion that the motivation...
The Lunar New Year is soon upon us, and we will be celebrating the Year of the Goat with firecrackers,...
2014: That was a year that was! Many of you, perhaps remembering my outlook missive from last year, must be...
Why DID you miss your 2014 3D Stacked DRAM equipment shipment forecast? And what’s different about the outlook for 3D Stacked...
Remember SEMICON West 2012? How could you forget? It was all clubbing with your customers at The Redwood Room, DNA...
While 3D IC production is underway for memory devices, some say demand for 3D ICs is still years away. Could...
While I don’t claim to be an expert in 3D NAND technologies, I do keep my eye on what’s happening...
True to form, Samsung followed up it’s V-NAND Flash announcement of 2013 with a product chip-level presentation at the 2014 IEEE International Solid-State...
If you’ve followed me thus far in the three preceding posts, well done! We started by questioning the cost assumptions....
