2016 will be remembered as the year fan-out wafer level packaging (FOWLP) went mainstream, thanks to TSMC’s strategic move in...
FLORIAN, Austria, July 11, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology...
Nimes, France, April 15, 2016 – FOGALE Nanotech today announced that it has acquired Altatech, a specialized technology leader in...
Flanders, New Jersey (September 1, 2015) — Rudolph Technologies, Inc. (NYSE: RTEC) announced the widespread adoption and success of its newest...
No SEMICON West would be complete without a few laps around Moscone North and South, and some one-on-one chats with...
As 3D integration technologies become established in low volume manufacturing, the supply chain is gearing up to address high volume...
Tool frees up valuable fab floor space for production equipment; allows for internal expansion of manufacturing capacity Fremont, Calif., July...
CIRCL-AP™ is a cluster tool with multiple modules, covering all-surface inspection, metrology and review at high throughput for efficient advanced...
As Si interposer and 3D stacked memory devices enter into production, albeit in low volumes, semiconductor manufacturers are lining up...
I can’t believe it’s already been a year since I last posted my annual guide to 3D at SEMICON West. ...
CIRCL CV310i module is an advanced Wafer Edge inspection, metrology and profiling system tailored for Advanced Wafer Level Packaging. Simultaneous...
Fully automatic, in-line X-ray metrology platform for the measurement and defect capture of both optically hidden and visible features in...
I first visited Nimes, France when I was sixteen, on one of those whirlwind, ten-day, school-organized trips with my French...
What better place for the Queen of 3D to start out her Europe in 3D tour than a late lunch...
Here’s one thing the team at Rudolph has a firm grasp on: understanding that feature sizes of today’s wafer-level, 2.5D...
Each year, I publish a Guide to SEMICON West 3D Events in an attempt to integrate both SEMI-sponsored events with...
Product Description Mass metrology is the measurement of the mass change on a wafer as a result of a wafer...
As the 3D standards initiative continues to gain traction within a number of participating organizations including SEMI, SEMATECH, JEDEC, IEEE,...
Is it mere co-incidence that companies who have invested in 3D technologies seem to have escaped the effects of the...
