At this year’s IEEE International Electron Device Meeting, [IEDM] (December in San Francisco) SK hynix gave an interesting look at...
Plainview, N.Y. — Veeco Instruments Inc. (NASDAQ: VECO) today announced that a mask blank supplier to the semiconductor industry has...
About 50 years ago, I started my career as a system-level designer, focused on an interface card for the Siemens...
If we look back, almost a decade ago, 3D stacked memory was all the rage, and the leader in stacked...
The San Francisco Hilton on O’Farrell Street welcomed IEDM 2019 and it’s 1800 attendees in early December. While the conference...
Samsung Electronics has announced the development of 12-layer memory using 3D through silicon via (3D-TSV) chip packaging technology. TSVs vertically...
“Combined DRAM and NAND revenue was US$25.4 billion in Q2 2019, down 5% from Q1 and down 39% year-over-year as...
The message remains consistent: following Moore’s Law is no longer economical for most IC designs. A major part of the...
Part 4 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with the future of...
The memory industry is experiencing a strong growth phase: the total memory market is expected to increase at a ~9%...
Data is now the world’s most valuable resource. Solid-state storage of data is driving an innovation revolution built upon 50 years...
Ever since 3D transistors (aka FinFETS or Intel’s Tri Gate) 3D NAND, and monolithic 3D IC processes joined the family...
There’s been a lot of buzz around 3D NAND in the past few weeks, sparked by Samsung’s recent announcement that...
We have a guest contribution from Zvi Or-Bach, the President and CEO of MonolithIC 3D Inc. Zvi adds information to...
One of these days, I’m going to go to CES. Since 3D integration technology isn’t the focus of the show,...
A new industry emphasis on 3D memory technology has prompted the 2010 IEEE International Interconnect Technology Conference (IITC) to expand...
