EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and...
Nanoimprint lithography (NIL) system will bolster process development and demo capabilities of INSPIRE program EV Group (EVG), a leading supplier of...
There is no rest for the weary. Just because we can finally declare that 3D ICs are in production doesn’t...
GRENOBLE, France – July 09, 2015 – IRT Nanoelec, an R&D consortium focused on Information and Communication Technologies (ICT) using...
At the beginning of April, the Semiconductor Industry Association released the 2013 International Roadmap for Semiconductors (ITRS), which has traditionally...
What can we expect out of 2.5 and 3D TSV Integration? What are the three leading-edge R&D institutes in 2.5...
First it was going to be memory stacks, then it was Wide I/O DRAM on Memory, and now, as commercialization...
Here I am, on my way back from Minatec Campus in Grenoble, France, where I attended SEMI Europe’s premiere European...
When it comes to fully understanding 3D integration processes, Sarah-Lyle Dampoux (my tour...
The day after Nicolas Sillon presented his keynote at IWLPC on interposer technology, we sat down to coffee and a...
The R&D centers were out in full force at this year’s SEMICON West, presenting on their latest activities in all...
Yes, there were lots of great conference sessions, keynotes, and products and technologies being showcased at SEMICON West 2011 (I...
CEA-Leti has announced a multi-partner project to demonstrate high-alignment-accuracy (<1µm) chip-to-wafer structures made by direct metallic bonding. Such structures are...
Last week (January 18 and 19, 2011), Leti lit up Grenoble, France with the inauguration of its 300mm 3D integration,...
CEA-Leti has opened a complete 300mm fab extension dedicated to 3D-integration applications. Final equipment installations will continue through to the...
Atrenta Inc., provider of Early Design Closure® solutions that improve design efficiency throughout the IC design flow, has signed a...
When a research institute is evaluating different options for technology partnerships, what tips the scales in favor of one supplier...
In developing an application to integrate 128 processors on a single chip, ST Microelectronics turned to Leti for assistance. To...
As human beings, we take a lot of things for granted; breathing, for example, or our heart beating when it...
CEA-Leti and SPP Process Technology Systems (SPTS) have agreed to develop advanced 300mm through-silicon via (TSV) 3D-IC processes at CEA-Leti’s...
