I don’t know why it still surprises me to read conflicting reports on the progress of 3D TSVs. But I...
Leading Semiconductor Equipment Maker and Renowned European Research Institute to Collaborate in Advanced Packaging Technologies under the Framework of Nanoelec RTI...
Through silicon via (TSV) reveal is a critical part of the wafer-thinning step in 3D IC backside processing, where the...
I have to admit, for some time I’ve been fairly skeptical about glass interposer technology as a viable alternative to...
Newport, United Kingdom, 22 May, 2014 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor...
Customers have asked and suppliers are listening. One sign of progress from last year to this year at SEMICON Singapore’s...
In 2013, SPTS equipment sales into the advanced packaging market grew by 75%. Some of this was due to a...
Product Description ReVia is a new endpoint detection (EPD) technique that can monitor the progress of “via reveal” etch processes...
Milestone shipment extends company’s leadership in DRIE Newport, United Kingdom, and SEMICON Singapore, 7 May, 2013 – SPTS Technologies, a supplier...
Now that the “technology bricks” for building 2.5D devices and 3D ICs have been essentially qualified, the focus has turned...
SPP Process Technology Systems (SPTS), has received a follow on purchase order from CEA-Leti for its Sigma® fxPTM Physical Vapor...
One year ago today, I was sitting with David Butler and Kevin Crofton, of SPTS, at the company headquarters in...
Yes, there were lots of great conference sessions, keynotes, and products and technologies being showcased at SEMICON West 2011 (I...
SPP Process Technology Systems (SPTS), a subsidiary of Sumitomo Precision Products Co., Ltd. (SPP), celebrates one year since it began...
When a research institute is evaluating different options for technology partnerships, what tips the scales in favor of one supplier...
SPP Process Technology Systems (SPTS) announced the opening of its new facility in San Jose, CA, serving as the home...
Oh…..and a bus. It takes one of each to get to Newport, South Wales from Munich.
Time for a little reflection… can we say that there was an air of optimism at SEMICON West this year?...
CEA-Leti and SPP Process Technology Systems (SPTS) have agreed to develop advanced 300mm through-silicon via (TSV) 3D-IC processes at CEA-Leti’s...
SEMICON Singapore gets underway next week (May 19-21), and the 3D track speaker line-up features...
