If you love, like me, to work on the bleeding edge of technology, you will find that your personal success...
Metrology, process control, and electrical test are key enablers for the success of the semiconductor industry. 3D integration using TSVs...
Don’t let the skeptics fool you, contrary to popular belief, the 3D test community has been hard at work on...
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. For a long...
Product Description FormFactor’s NanoPierce™ contactor is a socket solution for direct testing of TSVs and micro-bump arrays for 3D IC...
The 2013 3D-TEST Workshop focuses exclusively on test of and design-for-test for three-dimensional stacked ICs (3D-SICs), including Systems-in-Package (SiP), Package-on-Package...
After 20 years of chasing elusive Known Good Die (KGD) to achieve high yielding advanced interconnect technologies, the semiconductor industry...
