Xperi is a new entity with a complicated back-story, but a pretty cool vision for its future. First, there was...
The 2017 3D InCites Awards program has turned out to be the most exciting yet! We had as many as...
Semiconductor Manufacturing International Corporation, one of the leading semiconductor foundries in the world and the largest and most advanced foundry...
The industry standard interconnect technology for fine-pitch 2.5D assembly and 3D stacking is thermocompression bonding of solder capped μbumps. This...
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that Sandia National Laboratories signed a...
Tessera Technologies has been testing the 3D waters for several years, with the launch of its wholly owned subsidiary, Invensas,...
SAN JOSE, CA (August 28) — Tessera Technologies, Inc. announced the acquisition of Ziptronix, Inc. for $39 million in cash....
We’ve heard it expressed many times whenever there’s a new interconnect technology vying for adoption: manufacturers will select the best...
While GLOBALFOUNDRIES and STATS ChipPAC may have it all figured out, there are many who still consider temporary bond/debond (TB/DB)...
Tessera Technologies, Inc., announced today that Invensas Corporation, its wholly owned subsidiary, and Seoul, South Korea-based STS Semiconductor & Telecommunications...
Tessera Technologies, Inc. and Samsung Electronics Co., Ltd. announced today that Tessera’s subsidiaries Tessera, Inc. and Invensas Corporation each entered...
It may have been a coincidence that at last week’s 3D ASIP Conference, Invensas, Tezzaron/Novati, and Ziptronix booths were lined...
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that it is partnering with Tezzaron...
Invensas Corporation, a leading provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), today...
At the BiTS Workshop 2013, the talk show segment, Talking Points, examined the concept of Interconnectology and how adopting new...
While most of the semiconductor trade publications wrapped up their 2013 prediction posts by mid January, Semiconductor Packaging News (SPN) forged...
Since the early days of 3D InCites, as a member of our technical advisory board, Sitaram Arkulgud has been one...
After attending last week’s 9th Annual Architectures for Semiconductor Integration and Packaging Conference in Redwood City, CA, it’s pretty clear...
I spent this whole week at IMAPS 2012 in San Diego, and tweeted live from the event. Sometimes in the...
Invensas Corporation, provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc. unveiled its bond via array...
