Semiconductor packaging is a complex and evolving field, involving multiple disciplines. As a microelectronics packaging engineer, I focus on the...
Call me crazy, but after spending three days at the 2024 International Microelectronics and Packaging Society (IMAPS) Symposium in Boston...
You may have heard of the company, Averatek. Founded in 2009 out of the Stanford Research Institute, it developed and...
SAN JOSE, CA (August 28) — Tessera Technologies, Inc. announced the acquisition of Ziptronix, Inc. for $39 million in cash....
Interconnectology returned as a topic of discussion to the 2014 BiTS Workshop through a keynote discussion delivered by Invensas’ president,...
Invent, Innovate, Implement continues to be the mantra at EV Group, supplier of wafer bonding and lithography equipment for the MEMS,...
Rarely do I have the opportunity to visit a company two times and find something new to write about, never mind...
It may have been a coincidence that at last week’s 3D ASIP Conference, Invensas, Tezzaron/Novati, and Ziptronix booths were lined...
The 10th International Wafer-level Packaging Conference (IWLPC 2013) was held at the DoubleTree Hotel in San Jose this week. I...
New this year at SEMICON West, and just introduced to the program late last week, the Expert TechHUBs will help...
Semiconductor supply chain, ecosystem, value chain: whatever you call it, its become a hot topic of discussion, and one that...
At the BiTS Workshop 2013, the talk show segment, Talking Points, examined the concept of Interconnectology and how adopting new...
Every year in early March, I spend a day at the BiTS Workshop (Burn-in Test Strategies), not because it’s a...
Oh yes, where was I before the holidays took over and hijacked my life for two weeks? I’ll bet you...
In last week’s coverage of the Known Good Die Symposium, I talked about the notion of shifting focus from Known...
