June and July have been busy months from a semiconductor conference perspective. VLSI, IITC, imec IFT America, CEA-Leti Innovation Days,...
System-technology co-optimization (STCO) – enabled by 3D integration technologies – is seen as a next ‘knob’ for continuing the scaling...
Imec did their usual stellar job of demonstrating what needs to happen in the semiconductor manufacturing world to enable the...
MILPITAS, CA — January 11, 2018 — SEMI today announced that Luc Van den hove, president and CEO of imec,...
LEUVEN, Belgium, and NORWOOD, MA —October 12, 2017—Imec, the world-leading research and innovation hub in nanoelectronics and digital technologies and...
Stacking chips on top of each other (aka 3D stacking) is a well-known approach to make more compact and powerful...
In recent years, the technology of 3D integration has evolved into an economically interesting road. In particular, the technology is...
San Francisco’s Moscone Center (above), the traditional home of SEMICON West trade shows, is undergoing major reconstruction work. Looking at...
The 2017 3D InCites Awards program has turned out to be the most exciting yet! We had as many as...
The data traffic explosion, fueled by the Internet of Things (IoT), social media and server applications, has created a need...
Is Moore’s Law dead or not? It depends on your perspective. Last week at ECTC 2016, Rozalia Beica, Dow Electronic...
Heterogeneous integration is in many ways different from other research technology platforms. For one thing, the technology is mostly driven...
For the past 2 to 3 years, 3D integration technology has developed into a technically and economically interesting road for further...
There is no rest for the weary. Just because we can finally declare that 3D ICs are in production doesn’t...
A few weeks ago, San Francisco’s Moscone Center hosted the Design Automation Conference (DAC 2015), with many EDA experts and...
As a topic of much discussion and debate, the Internet of Things (IoT) stole the show once again, this time...
One of the ways to build more complex, powerful, and cost-effective electronic systems is stacking chips on top of each...
My visit to imec to meet with the Cascade Micorotech and imec 3D Test collaboration team included a tour of...
For quite some time, the lack of cost-effective test solutions for 2.5D interposers and 3D stacked ICs (3D SICs) has...
Two schools of thought clearly emerged at last week’s European 3D TSV Summit, which took place on January 20 and...
