October 2024 member news was marked by significant developments and milestones. From the grand openings of cutting-edge facilities that enhance...
May member news showcases significant strides in advancing semiconductor technologies and fostering sustainability efforts. From strategic divestitures and innovative product...
IMAPS held its Arizona Chapter Event at Deca Technologies, which included a presentation from Clifford Sandstrom on: “Achieving High-Density Die-to-Die Integration with...
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This...
The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an...
Kristie will manage and produce IMAPS meetings from conception through completion. Her event responsibilities will include organizing a wide range...
IMAPS Reshoring Part 2: High-Density Build-Up Substrate Discussions Picking up where we left off in IFTLE 564, the second discussion...
IMAPS‘ inaugural CHIPCon 2023 – the reinvention of its Advanced SiP Conference – took place July 24-27 in San Jose....
The top global event for Chiplet and Heterogeneous Integration Packaging (CHIP), covering advanced technology developments and solutions, device integration strategies,...
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a Workshop to discuss and promote strategies to...
The top global event for Chiplet and Heterogeneous Integration Packaging (CHIP), covering advanced technology developments and solutions, device integration strategies,...
The top global event for advanced Chiplet and Heterogeneous Integration Packaging (CHIP) technologies to be held in July 2023 IMAPS...
Santee, Calif. — StratEdge Corporation,leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and...
The Most Comprehensive Program for Microelectronics and Advanced Packaging This Spring The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16,...
Happy Holidays! Here’s the last of our community news round-up for 2022. Can’t wait to see what’s in store for...
IMAPS 2022 Continued… This year’s IMAPS Symposium in Boston drew 925 attendees and featured: 20 technical and poster sessions 11...
IMAPS held its 55th International Symposium on Microelectronics in Boston, October 4-6 2022. The conference drew some 900+ attendees hungry for some...
Founder’s Award honors individuals who have made the most significant contributions to the microelectronics packaging industry Tempe, Ariz. – October...
The 55th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week in Boston with...
Are you listening to the 3D InCites podcast yet? We had a busy summer! Our listenership grew, and we achieved...
