While the COVID-19 pandemic has continued to cause mass disruption to the global economy during the past year, one notable...
The IEEE 3DIC Conference was held at North Carolina State University in Raleigh NC in person from Nov 15-18 2021....
Xperi Licenses Hybrid Bonding Technology to YMTC (Yangtze Memory Technologies Co) In October, Xperi announced it had licensed its hybrid...
Direct Bond Interconnect (DBI®) hybrid bonding portfolio licensed to YMTC for its 3D NAND memory products SAN JOSE, Calif. –Xperi...
Let’s take a final look at some of the presentations from the 2021 IMAPS Device Packaging workshop. Applied Materials Applied...
A Technology Chasm Until recently, the world of IC fabrication was neatly divided into the distinct stages of front-end and...
A Conversation with the Xperi Hybrid Bonding Team In the world of heterogeneous integration, hybrid bonding — and in particular,...
On Definitions and Buzzwords Long-time readers of IFTLE know that I’m sensitive about nomenclature and buzzwords. For instance: “nanotechnology” and...
IME – Hybrid Bonding Studies Singapore’s Institute of Microelectronics – IME / AStar – was certainly the most prolific presenter...
The IEDM conference always has a great display of leading-edge technology in the papers, but I always find a great...
More on TSMC’s SoIC Hybrid Bonding Technology Nikkei Asia announced that TSMC is working with Google and AMD to develop...
EVG®320 D2W die preparation and activation system provides seamless integration with third-party die bonders; completes EVG’s equipment portfolio for end-to-end...
See that title? That was only part of how I spent last Thursday (December 3). My morning started with the...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
I first started covering Ziptronix and its hybrid bonding technology back in 2007 when I was writing Perspectives from the...
Last year at ECTC 2019, Xperi officially launched DBI Ultra™; the die-to-wafer hybrid bonding version of the highly successful, wafer-to-wafer...
The expansion of hybrid bonding as a process for high-density packaging was the topic of some presentations presented at the...
The monthly MEPTEC Luncheons at SEMI in Milpitas focus on microelectronics packaging and test topics. Javier DeLaCruz, Xperi’s VP of...
Requirements for interconnect pitches of 20µm and below is expected to be the norm in the future. Since typical solder...
The Microelectronics Packaging & Test Engineering Council (MEPTEC) held its monthly meeting at SEMI in Milpitas on April 10. Two...
