By Jim Straus and Sally-Ann Henry, ACM Research While heterogeneous integration of multiple components and 2.5D/3D packaging techniques pair perfectly...
Papers will highlight heterogeneous integration solutions such as hybrid bonding, maskless lithography, and layer transfer technology for advanced packaging applications....
Riding the 3D/Heterogeneous Integration Wave For decades, the ability to achieve the necessary power, performance, area, and cost (PPAC) in...
Also: US CHIPS Seeking < $300M Proposals TSMC’s Offshore Fabs Nikkei Asia is reporting that TSMC’s $8B Japan chip project...
In 2023, The International Microelectronics Packaging Society (IMAPS) reinvigorated its Arizona Chapter with monthly events at member sites. So far,...
At the 2023 IMAPS Symposium in October, I had some great community member conversations about some of the hot topics...
This year’s IMAPS keynotes focused on advancements in heterogeneous integration (HI) technologies and chiplet architectures enabled by HI, driven by...
It wasn’t long ago that the IMAPS International Symposium focused mainly on legacy packaging technologies, occasionally dipping its toe in...
This week, we continue our look at the presentations at the IMAPS CHIPCon conference that was held at the end...
Fourteen years in existence, 3D InCites has been through some changes, from being a basic blogging platform focused only on...
IMAPS Reshoring Part 2: High-Density Build-Up Substrate Discussions Picking up where we left off in IFTLE 564, the second discussion...
With over 350 papers in 36 oral sessions and 5 interactive presentations, there was no shortage of content to absorb...
Hybrid bonding enables an assortment of possible chip architectures, mainly targeted at high-end applications including high-performance computing (HPC), artificial intelligence...
The semiconductor and microelectronics industries are in the midst of a workforce crisis created by, among other things, the combination...
Heterogeneous IC packaging is here. It is already in production, and increasingly more customers are developing and qualifying their products...
Samsung Foundry Forum Moonsoo Kang, Head of Business Development at Samsung Foundry, at the 2022 Samsung Foundry Forum (SFF) explained...
There is a bit of debate about the role that heterogeneous packaging plays in furthering Moore’s Law. Moore’s Law has...
System-on-Chip (SoC) integrates ICs (by reducing the feature size) with different functions such as central processing unit (CPU ), graphic...
DARPA often selects its research efforts through the Broad Agency Announcement (BAA) process. The Microsystems Technology Office (MTO) at DARPA...
Heterogenous integration in microelectronics requires advanced materials Tapei, Taiwan – September 12, 2022 – Brewer Science, Inc., a global leader...
