YES, a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and AR/VR applications, today announced that its...
Over the past several years many companies have been extolling the virtues of glass as a packaging medium. Corning Glass,...
A number of research articles have been published over the past several years showing the advantages glass-based solutions can bring...
Plan Optik AG, the leading manufacturer of customized wafers from glass, quartz or glass-silicon compound materials has launched its new...
We hit the exhibits at IWLPC 2019 with a vengeance this year. Our mission was twofold – to find out...
For the past few years, the ECTC committee has provided 3D InCites with a table outside the session rooms, rather...
More than 25 years ago, Professor Rao Tummala founded Georgia Tech’s Package Research Center. However, his vision that advanced IC...
At the IEEE Global Interposer Technology (GIT2014) Workshop held at Georgia Tech on November 5-7, 2014, Georgia Tech announced the formation...
While the jury is still out on whether glass interposers will play a large or niche role in the interposer...
This year’s IMAPS International Symposium purported to have “the most interposer and 3D content under one roof.” I’m not sure...
In recent years, 2.5D packaging has quickly gained acceptance as an advanced packaging process, and the first products using this...
Glass has many properties that make it an ideal substrate for interposers such as: ultra-high resistivity and low electrical loss,...
While most of the research institutes in the US and Asia have been focused on commercializing 3D integration technologies for...
I have to admit, for some time I’ve been fairly skeptical about glass interposer technology as a viable alternative to...
Each year since I first attended the IEEE Electronic Component Technology Conference (ECTC) in 2009, the keynotes, panels and papers...
The 3rd annual Global Interposer Technology Workshop (GIT 2013) was held at the Georgia Institute of Technology on November 18-20, 2013....
The IEEE 3D Systems Integration Conference (IEEE 3D IC) is a unique event that is a truly international effort in assembling all...
SUSS, being an equipment maker addressing various manufacturing challenges faced by 3D IC enablement, definitely has a lot riding on...
The ECTC 2013 stats are in. This year showed increases across the board with: Over 1,300 attendees, the highest attendance...
We’ve been hearing and reading a lot about work being done at Georgia Tech’s PRC in developing glass interposer technologies...
