SAN JOSE, Calif. — Ziptronix, Inc., a wholly owned subsidiary of Tessera Technologies, Inc. (NASDAQ:TSRA) (“Tessera” or the “Company”) and...
Consider for a moment that the ultimate goal of 3D integration is not to achieve high volume manufacturing (HVM) in...
Since the days even before the reunification of Germany; Saxony, and particularly Dresden, has been a vital center for microelectronics development...
What can we expect out of 2.5 and 3D TSV Integration? What are the three leading-edge R&D institutes in 2.5...
Here I am, on my way back from Minatec Campus in Grenoble, France, where I attended SEMI Europe’s premiere European...
I’ve been on a mission to interview the directors of all three European microelectronics research centers that are participating in...
One of 60 research institutes that make up Germany’s Fraunhofer Gesellschaft, the Fraunhofer Institute for Reliability and Microintegration IZM is...
I usually never miss the Academy Awards, but this year I am in Germany visiting Fraunhofer IZM ASSID in Dresden...
All Silicon System Integration Dresden (ASSID), a leading-edge microelectronic wafer-level packaging and system integration center operated by the Fraunhofer IZM...
My recent visit to EV Group at its headquarters in Schärding, Austria, included some time spent with M. Jürgen Wolf,...
