Staying relevant in the ever-expanding technology landscape that is the semiconductor packaging industry can be a struggle for an event that’s...
The Great Miniaturization … SEMI/MEPTEC Conference Nov 10 & 11, continued from Part 1. Wednesday morning started with a IC...
The Great Miniaturization … SEMI/MEPTEC Conference Nov 10 & 11 After 50 years of following Moore’s Law and reaping major...
Sadly, this year it was the 3D session track that had lots of empty seats at the 2015 International Wafer...
For quite some time on 3D InCites, we’ve talked about how breaking up SoC designs into specific functions not only...
Flanders, New Jersey (September 29, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has purchased Stella Alliance, LLC, a...
Flanders, New Jersey (September 1, 2015) — Rudolph Technologies, Inc. (NYSE: RTEC) announced the widespread adoption and success of its newest...
SPTS’s Sigma® fxP, is a well established PVD system used in advanced packaging applications such as UBM and RDL. It...
I was invited to attend Amkor’s bi-annual customer symposium, which was held in Santa Clara two weeks ago. It was...
As promised in part 1 of my ECTC 2015 blog about this impressive conference, see below summaries of presentations I...
Last week I attended the record-breaking 65th ECTC in San Diego: 20 percent more attendees, compared to last year’s conference...
Fan-out wafer level packaging’s star is clearly on the rise as a low-cost solution for consumer mobile products, and the...
A second side trip on the way to DATE 2015 brought me back to Nimes, France to check up on...
TechSearch International Analyzes Flip Chip and Wafer Level Package Growth Flip chip and wafer level package (WLPs) shipments continue to...
Intent in fostering collaborative innovation across the supply chain, Yole Développement and the National Center for Advanced Packaging (NCAP) teamed...
Manufacturing of 3D IC heterogeneous integrated modules for the electronics of a leadless pacemaker in a very small volume has...
NANIUM S.A. has introduced an improved dielectric material and process solution for its fan-out wafer-level packaging (FOWLP) technology, embedded wafer-level...
The official inauguration of STATS ChipPAC’s 300mm eWLB facility was held September 15, at the company's Yishun facility in Singapore...
