Lam Research Corp. (Nasdaq: LRCX) is offering new capabilities in its semiconductor manufacturing systems portfolio to further improve device yield...
Fraunhofer IZM Selects SPTS’ DRIE and Low Temperature CVD to Develop Next Generation Manufacturing Techniques ORBOTECH LTD. announced that SPTS...
In June 2014, SPTS co-produced a webinar with Ron Huemoeller of Amkor, titled “2.5D and 3D Packaging at the Tipping Point.”...
Move to 300mm Strengthens Customer’s Position in the Rapidly Growing CMOS Image Sensor Market Newport, United Kingdom, 29 May, 2014...
Product Description ReVia is a new endpoint detection (EPD) technique that can monitor the progress of “via reveal” etch processes...
Milestone shipment extends company’s leadership in DRIE Newport, United Kingdom, and SEMICON Singapore, 7 May, 2013 – SPTS Technologies, a supplier...
Now that the “technology bricks” for building 2.5D devices and 3D ICs have been essentially qualified, the focus has turned...
I have to admit that this year at IMAPS Device Packaging Conference, I spent more time attending technical sessions and...
One year ago today, I was sitting with David Butler and Kevin Crofton, of SPTS, at the company headquarters in...
