October 2024 member news was marked by significant developments and milestones. From the grand openings of cutting-edge facilities that enhance...
TSMC/Amkor agreement Will Put U.S. Advanced Packaging on The Map TSMC has signed a memorandum of understanding (MoU) with Amkor...
In August of 2023, I attended the inaugural meeting of the Southwest Advanced Prototyping (SWAP) Hub, spearheaded by the Ira...
This June, we’ve seen exciting strides in AI for semiconductor design, showcasing how AI and Digital Twin technologies are revolutionizing...
2024 is a big year for 3D InCites members at the Electronic Components and Technology Conference (ECTC). With 34 of...
March buzzed with innovation and collaboration in the semiconductor industry, as key players across the globe joined forces to advance...
IMAPS 20th Annual Device Packaging Conference – Event Highlights The International Microelectronics Assembly and Packaging Society (IMAPS) 20th annual Device...
It was an interesting year for the 2024 3D InCites Awards as we changed our processes, criteria, and categories to...
IMAPS held its Arizona Chapter Event at Deca Technologies, which included a presentation from Clifford Sandstrom on: “Achieving High-Density Die-to-Die Integration with...
In 2023, The International Microelectronics Packaging Society (IMAPS) reinvigorated its Arizona Chapter with monthly events at member sites. So far,...
October flew by and our community members were busy… Deca was the recipient of the prestigious IMAPS Corporate Recognition Award...
It wasn’t long ago that the IMAPS International Symposium focused mainly on legacy packaging technologies, occasionally dipping its toe in...
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This...
Continuing our look at the IMAPS Onshoring conference with a look at U.S. OSAT activities. (We should note that while...
Is the Wild West becoming America’s center of microelectronics innovation? Based on the current wave of activity across the semiconductor...
Wow, wow, wow, 3D InCites community members are going to be well represented at next week’s Electronics Components Technology Conference...
The 19th Annual Device Packaging Conference (DPC 2023) is scheduled for next week, March 13-16, 2023, at the WeKoPa Conference...
Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968,...
Happy Holidays! Here’s the last of our community news round-up for 2022. Can’t wait to see what’s in store for...
Founder’s Award honors individuals who have made the most significant contributions to the microelectronics packaging industry Tempe, Ariz. – October...
