Last year at ECTC 2019, Xperi officially launched DBI Ultra™; the die-to-wafer hybrid bonding version of the highly successful, wafer-to-wafer...
SAN JOSE, CA (FEBRUARY 6, 2020) – Xperi Corporation (NASDAQ: XPER) (“Xperi”) today announced that it entered into a new...
Requirements for interconnect pitches of 20µm and below is expected to be the norm in the future. Since typical solder...
I’ve been following the DBI story for over a decade (well before Xperi became a sponsor of 3D InCites). I’ve...
The Microelectronics Packaging and Test Engineering Council (MEPTEC) held its annual heterogeneous integration symposium at SEMI’s headquarters in Milpitas, CA...
Hybrid bonding is quickly becoming recognized as the preferred permanent bonding path for forming high-density interconnects in heterogeneous integration applications,...
Xperi is a new entity with a complicated back-story, but a pretty cool vision for its future. First, there was...
Semiconductor Manufacturing International Corporation, one of the leading semiconductor foundries in the world and the largest and most advanced foundry...
The industry standard interconnect technology for fine-pitch 2.5D assembly and 3D stacking is thermocompression bonding of solder capped μbumps. This...
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc., (Nasdaq: TSRA) has announced that Fraunhofer EMFT has signed a...
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that Sandia National Laboratories signed a...
Sitaram Arkalgud, VP 3D technologies, Invensas, provided the entertainment at last week’s IWLPC 2015. As soon as he realized Phil...
Tessera Technologies has been testing the 3D waters for several years, with the launch of its wholly owned subsidiary, Invensas,...
Chalk up another industry first for Tezzaron Semiconductor, who announced just today (or tomorrow, if you are there for the excitement at IEEE...
SAN JOSE, CA (August 28) — Tessera Technologies, Inc. announced the acquisition of Ziptronix, Inc. for $39 million in cash....
Enables fine-pitch connections for 3D applications, including image sensors, memory and 3D SoCs RESEARCH TRIANGLE PARK, N.C., May 27, 2014...
Ziptronix Inc., provider of patented, low-temperature direct bonding technology for 3D integration, announced an agreement with Tezzaron Semiconductor Corporation and...
Micron’s recent announcement that they will be shipping samples of the Hybrid Memory Cube (HMC) and ramping to production in...
After seeing the latest press release on Ziptronix foray into the memory space, I sought out Kathy Cook, business development...
At RTI’s 3D ASIP last week, I sat down with Paul Enquist, of Ziptronix, to get an update on the...
