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IFTLE 396: DARPA Envisions CHIPS as New Approach to Chip Design and Manufacturing
First a word on the change in venue… After working with Pete Singer at Solid State Technology from 2010-2018 and...
Outlook 2017: SoC Goes on a Dielet
It’s 2017, and system-on-a-chip (SoC) is headed for a dielet. At least that’s my 2017 outlook, based on takeaways from...
MEPTEC Roadmap 2016: Best Time in History to be in the Packaging Business
With nary a farewell glance in the rearview mirror at the terrain successfully covered over the decades during which we...
Heterointegration, Friend or Foe: Opening the Door for Technologies Beyond Moore’s Law Silicon
What is heterogeneous integration, and is it my friend, or is it my foe? Why does it seem everywhere one...
Diverse Technology Selections Served at CS MANTECH 2015
What were all these silicon people doing at a compound semiconductor conference? CS MANTECH 2015 was the 30th anniversary version...
ASMC 2015: Has the Wonderment of Semiconductors Become a Presumption?
The 26th annual SEMI Advanced Semiconductor Manufacturing Conference was held in Saratoga Springs, NY, May 3-6, 2015. ASMC 2015 drew a...
Is Moore’s Law a Ceiling, Or Is It a Floor? More Notes From CS International 2015
Chris Mack, “Gentleman Scientist,” published an excellent piece on March 30, 2015 in IEEE Spectrum on “The Multiple Lives of...
Flying Many Flags: Heterogeneous Integration at CS International 2015
The fifth annual CS International Conference, 2015 edition, was held in Frankfurt, Germany, March 11-12, 2015. Very conveniently located in...
Activity Heats up for 3D IC Chip Cooling
3D ICs have clearly caught the eye of the military and aerospace electronics industries. I came across two separate announcements...
3D R&D Round-up: Part 1: RTI International
At last month’s 3D Architectures for Semiconductor Integration and Packaging Conference, coordinated by RTI International, three government-funded research institutes...
