Dense materials that exhibit high thermal conductivity are abundant in nature: think copper, think diamond, think silicon. And porous materials...
Fan-Out packaging solutions have been the hottest topic in the advanced packaging industry for two years, and that will remain...
Multichip module (MCM), system-in-package (SiP), system-on-chip (SoC), and heterogeneous integration are all important semiconductor packaging technologies. They deserve to have, at...
I’ve had an epiphany regarding fan-out wafer level packaging (FOWLP). Epiphany: “A usually sudden manifestation or perception of the essential...
What is heterogeneous integration, and is it my friend, or is it my foe? Why does it seem everywhere one...
What are the implications for the Internet of Things when the “Things” are human beings? As was said in a...
The Lunar New Year is soon upon us, and we will be celebrating the Year of the Goat with firecrackers,...
Tuesday’s (July 15) Nightly Business Report surprised me with an – in my view – very important announcement: Apple and...
All it takes is one look at the recent line-up on IHS iSuppli’s annual Semiconductor company ranking-by-revenue to see change is...
Is today the anniversary of something and I missed the memo? Because in less than 5 minutes of surfing, I’ve...
For me, Mondays are about regrouping, getting out of weekend head and into what’s going on in the 3D world....
Today is a sad day in the high tech industry. The news of the death of Apple Founder, Steve...
