Semiconductor device fabrication and packaging is rife with acronyms, and by my estimate, the Top 3 trafficked by speakers at...
In the fourth installment of the series “Convergence on the Big Five,” we compared conventional SiP with advanced system-in-package (SiP),...
Part four in a five-part series While many industry experts have long predicted the demise of Moore’s law, it’s only...
TEMPE, Ariz., June 28, 2016 – Driven by the increase in global demand for sensors from the smartphone and automotive...
Part three of a five-part series In the first two parts of this series, we focused on low-cost flip chip...
Part two of a five-part series. How did we determine which technologies are “the Big Five,” for semiconductor packaging? Essentially,...
Part one of a five-part series. Over the past few years, there has been a significant shift from PCs and...
Collected impressions of 2016 to date: the unfortunate passing of too, too many favorite musicians; the hard-to-escape-from strident bellicosity of...
Last June, AMD made 3D integration history with its introduction of the Fiji gaming processor unit (GPU), which for the...
I recently started watching the HBO sitcom, Silicon Valley. If you haven’t seen it, it’s a great parody of what...
Fan-out wafer level packaging’s star is clearly on the rise as a low-cost solution for consumer mobile products, and the...
I don’t know why it still surprises me to read conflicting reports on the progress of 3D TSVs. But I...
Here I am, on my way back from Minatec Campus in Grenoble, France, where I attended SEMI Europe’s premiere European...
After attending last week’s 9th Annual Architectures for Semiconductor Integration and Packaging Conference in Redwood City, CA, it’s pretty clear...
Amkor Technology, Inc. provider of semiconductor packaging and test services, has granted SHINKO Electric Industries Co, Ltd. a non-exclusive license...
Amkor Technology, Inc. , a leading provider of semiconductor assembly and test services, today announced that its innovative Through Mold...
Friday was the OSATs turn to offer their status reports with regard to market readiness for 3D TSV production.
After attending Curtis Zwenger’s presentation introducing Amkor’s latest contribution to the package-on-package (PoP) family based on the company’s proprietary
