News you may not have seen this month from our community members. Along with some upcoming participation to keep an...
IMAPS‘ inaugural CHIPCon 2023 – the reinvention of its Advanced SiP Conference – took place July 24-27 in San Jose....
The top global event for Chiplet and Heterogeneous Integration Packaging (CHIP), covering advanced technology developments and solutions, device integration strategies,...
SEMICON West 2023 is taking aim at Building a Path Forward with a reimagined exhibition and conference as industry experts and visionaries...
Our 3D InCites Community Members had an abundant amount of news to share this month, so we thought we should...
TEMPE, Ariz.–Jun. 13, 2023– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services and the...
Wow, wow, wow, 3D InCites community members are going to be well represented at next week’s Electronics Components Technology Conference...
For the first time in 3D InCites’ history, I was invited to attend a TSMC Technology Symposium, which took place...
Cadence, ASE Group, and Chung Yuan Christian University (CYCU) announced collaboration on an education and training program to cultivate talent...
Samsung Foundry Forum Moonsoo Kang, Head of Business Development at Samsung Foundry, at the 2022 Samsung Foundry Forum (SFF) explained...
TEMPE, Ariz. — March 28, 2023 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading outsourced semiconductor assembly and test (OSAT)...
The 19th Annual Device Packaging Conference (DPC 2023) is scheduled for next week, March 13-16, 2023, at the WeKoPa Conference...
Partnership expands European and transatlantic semiconductor supply chain TEMPE, Ariz. and DRESDEN, Germany, February 16, 2023 — Amkor Technology, Inc. (Nasdaq:...
Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968,...
Happy Holidays! Here’s the last of our community news round-up for 2022. Can’t wait to see what’s in store for...
SEMICON Europa kicks off next week as microelectronics experts and visionaries gather for insights into advanced technologies that are driving...
TEMPE, Ariz. — October 24, 2022 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test...
The 55th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week in Boston with...
The 72nd IEEE Electronic Components and Technology Conference (ECTC) was held again in person from May 31st to June 3rd,...
Next week the top global event for Advanced System-in-Package technologies comes to Sedona. Combining the 3D ASIP and IMAPS SiP...
