In IFTLE 541 I mentioned funding from the government organization known as the Industrial Base Analysis and Sustainment Program (IBAS)....
Last year (IFTLE 512) we discussed the SKC formation of the US subsidiary Absolics, and its glass core substrate manufacturing...
This week we continue our look at the IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, held...
The IPC Advanced Packaging Symposium: “Building the IC Substrate and Package Assembly Ecosystem” was held in Washington, DC in October....
Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle...
CHIPS Act Innovation Hubs SEMI has published an interesting article where they predict 10 likely locations for CHIPS Act Innovation...
The coming-of-age and breakthroughs offered by silicon carbide (SiC) MOSFETs, as well as demand that is outstripping supply are rapidly...
Nov 21, 2022, saw the groundbreaking for WestGate One, a semiconductor campus that will house the first fab in the...
I have a confession to make. Last March – we’re talking March of 2023 at IMAPS DPC – Beth Keser,...
IMAPS 2022 Continued… This year’s IMAPS Symposium in Boston drew 925 attendees and featured: 20 technical and poster sessions 11...
As we mentioned in IFTLE 537, IMAPS held the Onshoring: Packaging and Assembly Workshop prior to the traditional IMAPS fall...
Pat Gelsinger attended the WSJ Tech event in late October and as always had some interesting things to say about...
IMAPS held its 55th International Symposium on Microelectronics in Boston, October 4-6 2022. The conference drew some 900+ attendees hungry for some...
TEMPE, Ariz. — October 24, 2022 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test...
In IFTLE 534 we discussed the DARPA Next Generation Microelectronics Manufacturing (NGMM) program which will attempt to establish a domestic...
One of the things I love most about being part of the International Microelectronics and Packaging Society (IMAPS) is the...
Every now and then you run across a paper or presentation, and you say to yourself, “This clearly explains this...
IR laser cleave technology enables nanometer-precision layer transfer through silicon, eliminating glass substrates for advanced packaging and enabling thin-layer 3D...
Continuing our look at presentations at the 2022 ECTC, who better to examine the question “Panel Level Packaging – Where...
CHIPS and Science Act The CHIPS and Science Act will provide $54.2B in funding for the semiconductor and wireless industry,...
