MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior...
Santa Clara’s Convention Center was home to DesignCon 2019 from January 29-31, 2019. This conference is well known for showing...
“2017 was an unprecedented year for semiconductor industry”, comments Santosh Kumar, Director of Packaging, Assembly, and Substrates at Yole Korea, part...
TEMPE, Ariz. December 13, 2018 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of outsourced semiconductor assembly and test...
Last week at IWLPC, keynote speaker, Doug Yu, TSMC, kicked off the event with a similar storyline used by ASE’s...
BILLERICA, Massachusetts, USA, August 20, 2018 – MRSI Systems (Mycronic Group), is expanding its leading high-speed MRSI-HVM3 die bonder platform with...
Without any doubt, the advanced packaging industry is on the move. Emerging applications are bringing many new challenges. Packaging experts...
Dense materials that exhibit high thermal conductivity are abundant in nature: think copper, think diamond, think silicon. And porous materials...
Over the years, the semiconductor industry has relentlessly focused on shrinking gate dimensions to drive performance. This focus has now...
Part 1 of my 3D ASIP blog covered the five keynotes presented at 3D ASIP 2017. Part 2 focuses on...
Sitting in the bus on the way back from Grenoble to Airport Lyon, I am reflecting the last two days...
Wilmington, Mass. (September 12, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that its Firefly™ Inspection Systems, shipped to fulfill previously...
I am convinced that increasing device complexity, higher quality requirements (e.g. automotive and medical), as well as the need for...
Yole Développement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth in revenue of...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices, and CMOS image...
“Advanced substrates are the key interconnect component of advanced packaging architectures,” comments Andrej Ivankovic, Technology & Market Analyst, Advanced Packaging...
It’s been a nearly a month since the 2017 IMAPS Device Packaging Conference and Global Business Council, so I’ve had...
North Billerica, MA, USA, March 20, 2017 — MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding...
TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP TechSearch International predicts strong market growth for fan-in wafer level packages...
