This summer, the temperature reached 111°F in Silicon Valley, where I live. This historical record unmistakably brought home the “inconvenient...
Do you know how many individual elements and chemical compounds are required to make a circuit board? I don’t. There...
Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous integration. Different assembly processes are...
NCP and NCF Property Optimization Delivers High-Reliability Results Semiconductor package sizes are getting smaller and bump pitches narrower while the...
Continuing our look at presentations from the IMAPS SiP Conference. Ajinomoto Habib Hichri of Ajinomoto discussed the use of novel...
This past fall, our packaging industry saw significant shortages of packaging substrates made from Ajinomoto Build-up Film (ABF). Let’s take...
Avi Bar Cohen 1946 – 2020 Before we take a look at some interesting papers from the recent IMAPS 2020...
LAYERS 5, from Evatec, is your guide to all the latest thin-film technology news across advanced packaging, semiconductor, 0ptoelectronics, and...
Temporary wafer bonding processes were initially developed for enabling three-dimensional (3D) stacked integrated circuits (ICs). For example, dies can be...
Brian Schmalz, NAMICS, Talks About the Future of Electronics Materials Since we launched the program in January, the 3D InCites...
NAMICS Corporation has been recognized by Intel as a recipient of a 2019 Preferred Quality Supplier (PQS) Award. The PQS...
This week we continue our look presentations from SEMICON Europa’s Advanced Packaging Conference. Intel’s Reliability Test Beth Keser’s group at...
“We believe that materials science changes the world,” declared Indium Corporation’s Andy Mackie during our recent sit-down together at IMAPS...
More than 20 years ago, the cooperation between fabless IC vendors and wafer foundries started to dominate over the integrated...
Attending ECTC 2019 this year was like a trip through a time machine. From my post at the 3DInCites booth,...
While I’m only four chapters into Material Value written by my colleague and SemiSister, Julia Goldstein, I decided to write...
Continuing our look at presentations from the recent 2018 IWLPC conference, let’s look at the Jiw Pai Henkel presentation on...
According to the market research and strategy consulting company, Yole Développement (Yole), the polymeric materials market revenue will double over...
For the first time ever, the Materials Research Society (MRS) brought its annual Spring meeting to Phoenix. I have never...
2015 overall was a mixed year for the materials sector in the electronics market, with a general slowdown in PC-related...
