Indium Corporation® is pleased to introduce a new jetting solder paste to join its PicoShot® series of products. PicoShot® NC-6M...
Indium Corporation, a leading innovator in industrial material solutions, is thrilled to announce the appointment of Werner H. J....
PulseForge, a leader in photonic curing solutions, and Indium Corporation, a premier materials supplier to the electronics assembly industry, presented...
Brewer Science, a global technology leader in specialty materials for compound semiconductor manufacturing, invites attendees of CS Mantech to visit...
Experts to Present on High-Temperature, Lead-Free Solder Paste and High-Reliability Liquid Metal Alloys Poster at ECTC As an industry leader...
As one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical...
Indium Corporation, a global leader in materials science and electronics assembly solutions, commemorated its 90th anniversary on March 13. Indium...
San Jose, CA – February 21, 2024 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials...
NAMICS Technologies, Inc. has proudly welcomed Mr. Tatsuhiro Fujiki to its esteemed team as the newly appointed Chief Executive Officer....
Beginning August 1, 2023, China has imposed export restrictions on gallium (Ga) and germanium (Ge) products. These restrictions are seen as...
Let’s begin looking at some of the presentations from the 2023 IMAPS Device Packaging Conference in March. Showa Denko becomes...
Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle...
As we noted in IFTLE 537, prior to the 2022 IMAPS conference in Boston earlier this month, IMAPS hosted a...
As a graduate student in computer science, I was excited to learn about a machine learning internship at Brewer Science....
This summer, the temperature reached 111°F in Silicon Valley, where I live. This historical record unmistakably brought home the “inconvenient...
Do you know how many individual elements and chemical compounds are required to make a circuit board? I don’t. There...
Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous integration. Different assembly processes are...
NCP and NCF Property Optimization Delivers High-Reliability Results Semiconductor package sizes are getting smaller and bump pitches narrower while the...
Continuing our look at presentations from the IMAPS SiP Conference. Ajinomoto Habib Hichri of Ajinomoto discussed the use of novel...
This past fall, our packaging industry saw significant shortages of packaging substrates made from Ajinomoto Build-up Film (ABF). Let’s take...