Shield USA Project will strengthen U.S. semiconductor packaging capabilities The National Institute of Standards and Technology — part of the...
The European semiconductor packaging community, together with its international colleagues, supply chain partners, customers and guests met for a full...
TSMC/Amkor agreement Will Put U.S. Advanced Packaging on The Map TSMC has signed a memorandum of understanding (MoU) with Amkor...
I have spent a considerable amount of time covering the technology associated with the front-, and back end of-the-line. So...
US-China CHIP WARS Now Encompass Advanced Packaging In the Aug 21st issue of Asia Times, Scott Foster wrote an interesting...
Call me crazy, but after spending three days at the 2024 International Microelectronics and Packaging Society (IMAPS) Symposium in Boston...
(2nm semiconductor manufacturing foundries) UMC started the semiconductor manufacturing foundry business in 1980, followed a few years later by TSMC....
One of the ways I learn about advanced packaging technology and what it entails is by visiting our community member...
Kulicke & Soffa announced the introduction of its latest APTURA™ thermo-compression platform in addition to three new milestones relating to industry...
The system delivers superior uniformity, enabling performance and cost efficiencies for next-generation chip packaging ACM Research, Inc., a leading supplier...
Rosie Medina named senior VP of sales and marketing Promex; Matt Hansen named VP of sales and marketing at QP...
The National Advanced Packaging Manufacturing Program (NAPMP) is one of multiple CHIPS R&D initiatives that seek to create United States...
Deepak Chopra said, “All great changes are preceded by chaos.” Here’s my Aha! moment from SEMICON West 2024: After great...
In February 2024, CHIPS announced that $5B would be spent in the National Semiconductor Technology Center (NSTC) to drive innovation...
“The Road to the AI Era Is Paved in Semiconductor Manufacturing Innovation,” an in-depth white paper written by The TechArena...
Adds Fully Automated Dicing Saw to Equipment Line, Enabling Even Greater Precision, Throughput for Die Singulation QP Technologies™, a leading...
The Boston Consultant Group (BCG) recently took a look at the impact that advanced packaging is having on the microelectronics...
If you were one of the almost 2000 attendees at ECTC 2024, held May 28-31 2024, in Denver, Co, then...
PowerSIP™ increases power efficiencies by 50% in AI and data center applications Advanced Semiconductor Engineering, Inc. (ASE), a member of...
IFTLE has spent a lot of time recently focusing on the availability of U.S. government funds for the “onshoring” of...
