When I was first asked why I had not yet covered the “US Joint Consortium” I responded “tongue in cheek”...
There was a lot to be enthusiastic about at IMAPS Device Packaging 2025 (DPC2025). We presented the 2025 3D InCites...
Commercial Times reports that TSMC’s Arizona wafer fab, Fab 21 Phase 1, has officially entered mass production on its 4nm...
Micross, a portfolio company of Behrman Capital, announced on January 15, that it has acquired Integra Technologies, headquartered in Wichita,...
Heterogenous integration and AI are currently moving forward hand-in-hand as the demand for greater computing power in theory, reduces the...
As global semiconductor demand continues to surge, international collaboration has become essential for driving technological innovation. The US-JOINT consortium represents...
In 2024, New York’s semiconductor industry experienced substantial growth, driven by increased funding from both the U.S. government and the...
An inside look at how ASU, local governments, and private sector companies are working together to make Arizona a hub...
Broadcom has recently announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, enabling consumer AI...
Shield USA Project will strengthen U.S. semiconductor packaging capabilities The National Institute of Standards and Technology — part of the...
The European semiconductor packaging community, together with its international colleagues, supply chain partners, customers and guests met for a full...
TSMC/Amkor agreement Will Put U.S. Advanced Packaging on The Map TSMC has signed a memorandum of understanding (MoU) with Amkor...
I have spent a considerable amount of time covering the technology associated with the front-, and back end of-the-line. So...
US-China CHIP WARS Now Encompass Advanced Packaging In the Aug 21st issue of Asia Times, Scott Foster wrote an interesting...
Call me crazy, but after spending three days at the 2024 International Microelectronics and Packaging Society (IMAPS) Symposium in Boston...
(2nm semiconductor manufacturing foundries) UMC started the semiconductor manufacturing foundry business in 1980, followed a few years later by TSMC....
One of the ways I learn about advanced packaging technology and what it entails is by visiting our community member...
Kulicke & Soffa announced the introduction of its latest APTURA™ thermo-compression platform in addition to three new milestones relating to industry...
The system delivers superior uniformity, enabling performance and cost efficiencies for next-generation chip packaging ACM Research, Inc., a leading supplier...
Rosie Medina named senior VP of sales and marketing Promex; Matt Hansen named VP of sales and marketing at QP...
