10 ECP ap tools purchased by top-tier Chinese OSAT to support wafer-level packaging applications FREMONT, Calif., May 06, 2022: ACM...
ACM’s Ultra C VI Tool Supports Most Semiconductor Clean Processes for Advanced Logic, DRAM and 3D NAND Manufacturing; Provides 50%...
21 ECP tools ordered by top-tier Chinese foundry and multiple advanced package houses FREMONT, Calif., Feb. 17, 2022 (GLOBE NEWSWIRE)...
Wafer-level packaging (WLP) saw significant growth in 2021 due in large part to the increased performance needs of data-driven 5G...
Largest purchase order for wet bench systems in ACM’s history; Wet bench product line expanded to include Ultra-Low-Pressure Dry (ULD)...
SEMICON Europa is back! On the agenda? The latest innovations and smart applications powering the next wave of semiconductor industry...
FREMONT, Calif., Oct. 18, 2021 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing...
FREMONT, Calif., Oct. 18, 2021 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing...
Automated system for flat or notched wafers; multiple orders to ship during third quarter of 2021 Fremont, Calif. – August 25,...
Wet process offers edge etch and clean to improve wafer yield with high throughput and low chemical consumption; First tool...
One of the hottest trends in semiconductor manufacturing today is wafer-level packaging (WLP). According to Allied Market Research, the global...
While the global spotlight is shining on the importance of sustainability in semiconductors, the concept itself is not new. As...
New ECP ap capability controls the wafer-level electric field to deliver better uniformity within wafer and within die while achieving...
