Latest Posts - Page 3
Dow Introduces SOLDERON Tin-Silver Plating Chemistry for Lead-Free Bumping
The company’s next-generation SnAg offers industry-leading plating rates and process flexibility for flip chip packages and interconnects. Dow Electronic Materials... EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System for Micro-and Nano-Electronics Production
Flexible System Integrates Spin/Spray Coating and Wet Processing for MEMS, Advanced Packaging and Compound Semiconductor Applications SEMICON SINGAPORE, May 7,...
More than Moore and 3D IC: Decoding the Code at the GSA Silicon Summit 2013
There’s probably no more fitting venue for discussing future directions for processing and packaging technology in integrated circuit fabrication than...IMAPS 2012 3D Tweeture Double Feature – Part 2
With two 3D focused keynotes and a 3D panel discussion, 3D Thursday was ripe for the tweeting. The sound bites...SEMICON West 3D (and more) Mash-up
Now that I’ve finished (finally) writing and posting all 3D InCites original content, I thought I’d take a look around...3D R&D Update, As Told by the Experts
The R&D centers were out in full force at this year’s SEMICON West, presenting on their latest activities in all...2.5D and 3D Messages Worth Repeating
I listened in on yesterday’s webcast, 3D and 2.5D Integration: A Status Report Live Event hosted by Solid State Technology,...And Now, a Word for Our Sponsors
While there’s no denying that our registered members, guest bloggers, forum panelists, advisory board, and regular readers are all vital...MonolithIC 3D Inc.’s 2D and 3D-ICs Simulator Tool is a Worldwide Hit
MonolithIC 3D Inc., a Silicon Valley startup specializing in 3D ICs, announces a milestone with its 2D and 3D ICs...
SEMATECH to conduct rigorous manufacturability assessments to enable high volume manufacturing readiness of 3D technology
To enable high-volume production readiness of 3D-based products, SEMATECH’s 3D Interconnect and Manufacturability programs will be conducting Equipment Maturity Assessments...2.5D and 3D Supply Chain Solutions – is there only one?
I had a bit of an “aha!” moment yesterday at the MEPTEC 2.5D, 3D and Beyond Conference, with regard to...Ziptronix Signs Licensing Agreement with Sony
Ziptronix, Inc. has signed a licensing agreement with Sony Corporation for the use of Ziptronix’s patents regarding oxide bonding technology...Our Baby’s All Grown Up!
I just read Mark LePedus’ (EE Times) coverage of the 3-D Architectures for Semiconductor Integration and Packaging last week in...My Sojourn to SEMATECH
I’m a big believer in building relationships. One of my goals with 3D InCites is to make the rounds of...Is the Bloom off the 3D TSV Rose?
So I’m sitting here back at my desk, sifting through my pile of notes from this week’s adventures at the...Alchimer opens 300mm facility in Asia
Alchimer announced the opening of a new applications-and-development facility in Seoul, South Korea, for...SEMICON West: Success for 3D –focused Companies
Is it mere co-incidence that companies who have invested in 3D technologies seem to have escaped the effects of the...TSVs: Emerging No Longer
What makes something an emerging technology, and what makes it near-term? I asked this question of the IEDM technical committee...Alchimer: A Growing Concept
In an understated research lab and recently upgraded demo facility located just outside Paris in Massy, France, Alchimer scientists...
