Yesterday at the pre-conference symposium for 3D Architectures for Semiconductor Integration and Packaging (3D ASIP), I was fortunate to get an...
There are a couple of notable updates circulating this week involving companies in the 3D space. The first I saw...
The first European 3D TSV Summit (January 22-23, 2013) hasn’t even happened yet, and already its intended message is becoming...
After 20 years of chasing elusive Known Good Die (KGD) to achieve high yielding advanced interconnect technologies, the semiconductor industry...
The day after Nicolas Sillon presented his keynote at IWLPC on interposer technology, we sat down to coffee and a...
Eric Beyne (imec) and I go way back. He’s the Scientific Director of Advanced Packaging Technologies at imec, and ever...
Outsourced Semiconductor Assembly and Test (OSAT) provider, STATS ChipPAC Ltd., has announced qualification of its 300mm middle-end-of-line (MEOL) manufacturing operation for...
We’ve been hearing and reading a lot about work being done at Georgia Tech’s PRC in developing glass interposer technologies...
Note to self: no more graduations/college orientations/vacations in the month of June. There are way too many events in 3D...
Long before he set out on the 3D Holy Grail, Herb Reiter had other pursuits that involved bringing new technologies...
Ever since I put on the editorial director hat for 3D-ICs.com, which aggregates 3D technology news, blogs and papers, and...
San Jose, CA - September 29, 2011 - With the semiconductor industry’s transition to 3D-ICs gaining momentum, online resources focused...
Last week’s announcement of Alchimer’s expansion into Taiwan via its Representative agreement with Kromax International Corp. further exemplifies the company’s...
Once again, I can’t let my follow-up coverage of SEMICON West go by without reporting on my annual briefing with...
Sometimes I like to mix it up a bit. So last night I was the invited guest speaker at the...
While TSVs technologies make their way out of R&D on to the manufacturing floor, improvements and developments in non-TSV 3D...
It’s not often that I get to meet other members of the semiconductor aristocracy, so I was delighted to recently...
Ok, I’m annoyed. I just read an article (thanks for pointing me to it Gretchen Patti) that appeared last week...
Keith Cooper, Technology and Development, SET North America reports from ECTC 2010's Medical Device Market Panel, offering a view beyond...
I approached the IEDM 2011 conference, in (San Francisco this week) with much trepidation. Surely, most of these presentations would...
