Direct Bond Interconnect (DBI®) hybrid bonding portfolio licensed to YMTC for its 3D NAND memory products SAN JOSE, Calif. –Xperi...
Wet process offers edge etch and clean to improve wafer yield with high throughput and low chemical consumption; First tool...
“Combined DRAM and NAND revenue was US$25.4 billion in Q2 2019, down 5% from Q1 and down 39% year-over-year as...
Part 4 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with the future of...
Part 2 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with a history...
The mid-1920’s were the miracle years for quantum mechanics. The “Old Quantum Theory” originating with Niels Bohr, had reached crisis point by the...
Philadelphia PA, USA, July 10, 2017 – EMD Performance Materials, a leading science, and technology company, today announced its portfolio...
There is fierce competition for scaling foundry logic technologies. However, according to the 2015 International Roadmap for Semiconductors (ITRS), logic transistor...
“On average since 1885, the yearly height record has gone up by 10 feet (3 meters) each time. Since the...
The Challenges of Manufacturing 3D Stackable Memory Memory technologies vying to fulfill the increasing capacity and density requirements of the...
The 3D NAND floodgates just opened a little wider with today’s announcement from BeSang that it has developed 3D Super-NAND...
BeSang Inc., a pioneer in the monolithic 3-dimensional integrated circuits (3D ICs), announced today its proprietary 3D super-NAND development. “We are...
In July and August schools are closed and many people like to take vacation. Typically nothing major happens during these...
It’s been many years since I realized that semiconductor conferences were not purely scientific but had a certain mix of...
An epiphany struck me last week when I attended the Flash Memory Summit in Santa Clara, California. I had come...
Today, LinkedIN reminded me that 3D InCites just celebrated its 6th anniversary. I also noticed that Paul Werbaneth’s latest 3D+...
Ever since 3D transistors (aka FinFETS or Intel’s Tri Gate) 3D NAND, and monolithic 3D IC processes joined the family...
2014: That was a year that was! Many of you, perhaps remembering my outlook missive from last year, must be...
Finally! After a year’s worth of guesswork, Samsung’s 3D V-NAND Flash cell has been revealed. Thanks to the expertise of...
Samsung’s introduction of its 3D NAND Flash SSD 850 Pro has led to the inevitable hullabaloo. Amid all the fuss, it hasn’t...
