Latest Posts - Page 7
Is TSMC putting all its Eggs (or Apples) in one Basket?
For those of us who attended Doug Yu’s keynote address at the 3D Architectures for Semiconductor Integration and Packaging Conference...Tezzaron Acquires Texas Semiconductor Facility
Tezzaron Semiconductor has signed a contract to purchase the assets of a semiconductor technology development and wafer fabrication facility in...IEDM Panel Gives 3D the Green Light
Word on the street is, if 3D is serving a niche market, it’s going to be a big niche! At...Europe Targets Leadership in Next-Generation “Smart Systems”
The partners in a new European research project today announced details of the multinational/multidisciplinary 'SMArt systems Co-design' (SMAC) program. This...SPTS Wins New 300mm PVD Order from CEA-Leti
SPP Process Technology Systems (SPTS), has received a follow on purchase order from CEA-Leti for its Sigma® fxPTM Physical Vapor...GLOBALFOUNDRIES and Amkor to Collaborate on Advanced Assembly and Test Solutions
GLOBALFOUNDRIES and Amkor Technology, Inc. have entered into a strategic partnership to develop integrated assembly and test solutions for advanced...Pistorio for President
If anyone could give President Obama a run for his money in 2012, I think it might just be Pasquale...ECTC 2011 – It’s a Small World After All
I ask you, could there be a better place to host a conference dedicated to micro and nano electronics than...Alchimer Discloses Major TSV Barrier Film Advance
A new film-deposition technology advance from Alchimer S.A.is said to cut fill deposition times and could provide new options for...
SPTS Ships APS Etch System To Fraunhofer ISIT
SPP Process Technology Systems (SPTS) has shipped an APS etch system to Fraunhofer ISIT (FhG-ISIT). The system will add new...CEA-Leti Ramps up 300mm Line Dedicated to 3D-Integration Applications
Grenoble-based research institute, CEA-Leti, will significantly expand its technology offering this month when it ramps up one of Europe’s first...3D Integration Research, SEMATECH Style
SEMATECH’s story is one that is truly built upon the essence of collaboration. SEMATECH is not a traditional research center. ...Is the Bloom off the 3D TSV Rose?
So I’m sitting here back at my desk, sifting through my pile of notes from this week’s adventures at the...EV Group: “Triple I” at Work
It’s a good story that’s been 30 years in the making. From its founding by Erich and Aya Maria Thallner...SUSS MicroTec Appoints New VP R&D
SUSS MicroTec has appointed Dr Rainer Knippelmeyer as VP R&D and CTO. In this function Rainer Knippelmeyer will oversee research...SPTS Triples Revenue in 1st Half 2010 over 1st Half 2009
Exhibiting for the first time at SEMICON West 2010 as the newly-formed SPP Process Technology...CMP/CMC/MOSIS partner to introduce a 3D-IC process
CMP/CMC/MOSIS announced a Grenoble-France based partnership for a 3D-IC multi-project wafer (MPW) service based on Tezzaron’s SuperContact technology and...
