Latest Posts
Siemens Delivers a Leap Toward Mainstream 3D-IC Adoption with Calibre 3DThermal
Calibre 3DThermal delivers complete chip and package-inward thermal analysis software for 3D-ICs, addressing critical design and verification challenges from early-stage...
Big Data, Speed and Security Dominate DesignCon 2020
About 5000 attendees, as well as more than 200 exhibitors, took over the entire Santa Clara Convention Center from January...
Path Finding Series Part 3: The Cost of Non-robust Design
In previous posts, I discussed a process for process-centering a design. In this post, we will examine how non-robust design’s...
E-System Design: Sphinx 3D Path Finder (“3DPF”) V3.0
The Sphinx 3D Path Finder (3DPF) is an exploration tool enabling fast test case creation and analysis for silicon and...
Catching Up With Steve Breit, Coventor, at the TSensors Summit
A journey of a trillion sensors begins with a single step. The TSensors Summit, held at Stanford University on 23...
Momentum Builds for the 2013 3D InCites Awards
Subscribers are practically blowing up 3D InCites as they duke it out online and race the July 3rd deadline for...
Mentor and Tezzaron Optimize Calibre 3DSTACK for 2.5D/3D-ICs
WILSONVILLE, Ore., May 20, 2013—Mentor Graphics Corp. (NASDAQ: MENT) and Tezzaron Semiconductor Corp. today announced they are collaborating to integrate...3D EDA Tools – Coming out of the Woodwork
That didn’t take long. A post about one EDA tool introduction inspired a comment about a 3D layout editor that’s...DATE 2009 Addresses Design for 3D Integration.
It looks as though the call is finally being heard. Those deeply involved in 3D IC Integration using through silicon...
Lisa McIlrath, R3 Logic: design tools for 3D IC are on the way
Mea culpa. I may have jumped to conclusions in yesterday’s post. Although it appears to those developing 3D IC integration...3D Panel tackles the TSV test conundrum….and some other things
Whether you’re a believer or a skeptic, there’s no arguing that discussions on 3D continue to draw a crowd....
Atrenta and CEA-Leti Sign a Multi-Year Collaboration Agreement
Atrenta Inc., provider of Early Design Closure® solutions that improve design efficiency throughout the IC design flow, has signed a...Focus on 3D Design
Will this be the year for 3D IC design tools? Who knows for sure? But by the looks of the...From the DPC: Panelists address burning questions for 3D IC integration
I’m glad I stuck around last evening for the 3D panel discussion on the status of 3D integration technologies, applications...