Latest Posts
‘Tis the Season for the 3D ASIP Multi-Die IC Design Tutorial
While the shopping malls and specialty stores in and around San Francisco were packed with people hunting for Holiday presents,...
Path Finding Series Part 3: The Cost of Non-robust Design
In previous posts, I discussed a process for process-centering a design. In this post, we will examine how non-robust design’s...
3D ASIP 2014 Sparks Mixed Reactions from the Media
Isn’t it interesting how different people attending the same event can come away with different perspectives? I attended last week’s...
3D ASIP Pre-Conference Symposium brings together Design and Process for 3D ICs
Despite efforts to leverage the one hour time difference from Phoenix to San Francisco to my advantage, I arrived on...
GSA 3D IC Working Group Looks at 3D IC Readiness from Design through Manufacturing
At the recent GSA 3D IC Working Group Meeting (October 22, 2014), where speakers from BroadPak, Amkor, and Invensas presented...
3D By Design: A Blog By and For the 3D Design Community
Earlier this year, I published an open letter to chip and system-level designers regarding 3D integration, suggesting they consider 3D...
Catching Up With Steve Breit, Coventor, at the TSensors Summit
A journey of a trillion sensors begins with a single step. The TSensors Summit, held at Stanford University on 23...
Playing the 3D IC Glad Game
I admit it. I have always been a card-carrying member of the Pollyanna Club. What’s wrong with approaching challenges with...
3D InCites Awards Public Opinion Poll Results Are In!
The public opinion poll closed for the first annual 3D InCites Awards on Wednesday July 3, with over 1350 votes...
Cielution: CielSpot, CielSpot-CTM, CielMech
Product Description CielSpot, CielSpot-CTM and CielMech are thermal and mechanical simulation Software As A Service (SAAS) products based on Cielution’s... E-System Design: Sphinx 3D Path Finder
Product Description 3DPF is a full wave 3D path finding tool based on a patented, mesh-less algorithm for cylindrical objects...
Fraunhofer IZM Update with M. Juergen Wolf
I’ve been on a mission to interview the directors of all three European microelectronics research centers that are participating in...GSA’s Silicon Summit: Good News from the 3D Ecosystem Panel
I don’t get to attend all the 3D events that I would like to, and such was the case with...Show Me The Money: 3D Friday at EDPS
While it was Good Friday for most, it was 3D Friday for those of us who attended the 19th Annual...Keeping up with 3D InCites
I woke up to some especially good news this morning. Yann Guillou of ST Ericsson has accepted our invitation to...Successful 3D Integration takes more than new technologies
In last week’s discussions in the design space — Is TSV a...
Designers add their voice to the 3D integration journey
After being immersed in the 3D design world over the past few weeks I realized a few fundamental differences between...Pre-conference symposium reviews 3D integration
It’s always a challenge to adequately sum up several hours of detailed discussion on a topic, and this afternoon’s symposium...