As semiconductor devices are subject to increasingly higher quality and reliability standards, extensive measures must be taken to ensure these...
The monthly MEPTEC Luncheons at SEMI in Milpitas focus on microelectronics packaging and test topics. Javier DeLaCruz, Xperi’s VP of...
Samsung reports that they have seen increasing interest in multi-die integration (what they call MDI) for markets such as artificial...
When asked by Beth Keser and Steffen Krönert to review their new book, Advances in Embedded and Fan-out Wafer Level...
Would it be flippant to say that the most pivotal event that impacted the commercialization of 3D integration technologies, may...
“2.5D and 3D stacking technologies are the only solution that meet the required performance of applications like AI[1] and datacenter...
Last week at IWLPC, keynote speaker, Doug Yu, TSMC, kicked off the event with a similar storyline used by ASE’s...
The people have spoken! The results of last week’s poll are in, and it looks like the majority of those...
When planning the 24th EDPS, the organizing committee, chaired by Shishpal Rawat, former Intel executive, took a number of bold...
Artificial Intelligence (AI) is driving the development of 3D TSV and heterogeneous integration technologies. With its new 3D TSV &...
Editor’s note: For several years now, Mentor Graphics has evangelized about the critical need for assembly design kits to enable...
A new book on 2.5D and 3D integration, written by Riko Radojcic and published by Springer, will soon be available....
This year again, both market segments, high end, and low end, are the main targets of through silicon via (TSV)...
High-bandwidth memory (HBM) is a JEDEC-defined standard, dynamic random access memory (DRAM) technology that uses through-silicon vias (TSVs) to interconnect...
A little over a year ago, I wrote a Knowledge Portal entry about the cost of 3D ICs. Here I...
If I had not attended the 2015 3D ASIP conference, my outlook for 2016 would have been less upbeat for...
Flanders, New Jersey (September 29, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has purchased Stella Alliance, LLC, a...
SAN JOSE, CA (August 28) — Tessera Technologies, Inc. announced the acquisition of Ziptronix, Inc. for $39 million in cash....
Historically, we all took Moore’s Law for granted. With each new node, we could expect to see faster-performing devices, smaller...
Subu: “I find the whole concept of 2.5D fairly atrocious. I have banned its use.” Rao: “what are you going...
