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Monozukuri CEO Reveals Gordon Moore’s Advanced Package Vision 

Chip/Package Co-Design May Fulfill a Second “Moore’s Law” Gordon Moore predicted the demise of Moore’s law and envisioned in its place larger systems built from smaller, separately packaged, interconnected systems, according to Anna Fontanelli, Monozukuri S.p.A. CEO and Founder. Opening her presentation yesterday on innovative advanced packaging approaches during the...

Member Monthly Highlights – November

IMAPS held its Arizona Chapter Event at Deca Technologies, which included a presentation from Clifford Sandstrom on: “Achieving High-Density Die-to-Die Integration with Adaptive Pad Stacks on Molded Embedded Bridge Die Interposers,” and a happy hour of networking. MKS/Atotech was in attendance at the TPCA Show 2023 showcasing advanced process, laser drilling and...

Community Member Monthly News – October

October flew by and our community members were busy… Deca was the recipient of the prestigious IMAPS Corporate Recognition Award in San Diego for its significant technical contributions to the microelectronics industry. Robin Davis, Sr. Director of Business Development at Deca, was also recognized with the impressive IMAPS Emerging Leadership...

CEA and Siemens Collaborate on Research to Expand Applications of Digital Twin for Industry

Research collaboration to bring greater use of artificial intelligence and cloud computation in the world’s most comprehensive digital twin across electronics systems based industry sectors Siemens Digital Industries Software and CEA-List, a technological research institute focused on smart digital systems research, announced today the signing of a memorandum of understanding...

Media Hub Rendering

SEMICON West 2023 Member Preview

SEMICON West 2023 is taking aim at Building a Path Forward with a reimagined exhibition and conference as industry experts and visionaries gather July 11-13 at the Moscone Center in San Francisco. The event focuses on key challenges affecting the global microelectronics industry which include Supply Chain Disruptions, Climate Change, and Talent...

3D InCites Community Member Monthly Highlights — June

Our 3D InCites Community Members had an abundant amount of news to share this month, so we thought we should do a quick recap in our June edition of monthly highlights. If you have news to share, please don’t forget to share it with your 3D InCites team! ASE announced...

Micross Acquires Technograph Microcircuits Ltd., Expands Portfolio of Packaging and Substrate Capabilities for Multi-Chip-Modules, ASICs and PCBs

Melville, NY (May 2, 2023) – Micross Components (“Micross”), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical, energy, industrial and other applications, today announced the acquisition of Technograph Microcircuits Ltd, (“TechnoGraph” or the “Company”), a leading provider of hybrid integrated circuits, RF &...

IFTLE 553: Samsung Foundry Update; Amkor/ GlobalFoundries Venture

Samsung Foundry Forum Moonsoo Kang, Head of Business Development at Samsung Foundry, at the 2022 Samsung Foundry Forum (SFF) explained that they would be using advanced heterogeneous integration as a method of streamlining and improving the process of integrating separately manufactured chip components into a single assembly level. Figure 1...