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On December 29, 2022, Infostone 2022 Annual meeting and the 9th Heroes List award live conference was successfully held. During the conference, Infostone announced the 9th heroes company list in four categories: “The Most Competitive Products of Optical Communication”, “Excellent Quality Award”, “Outstanding Technology Award” and “Recommended Brand Award”, which...
Acquisition Expands Micross’ High-Reliability Power Management Solution Capabilities Melville, NY – January 10, 2023 – Micross Components, Inc. (“Micross” or the “Company”), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial applications and a portfolio company of Behrman Capital, today announced signing...
The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration in Europe. The conference takes place every two years and is the IEEE EPS flagship conference in Europe, organized by IEEE EPS Region 8 (EMEA) Chapter in association with IMAPS...
I have a confession to make. Last March – we’re talking March of 2023 at IMAPS DPC – Beth Keser, IMAPS president, presented me with a signed copy of the book she co-edited with Steffen Khröhnert – Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces:...
The 55th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week in Boston with a focus on PACKAGING TECHNOLOGIES ENABLING THE NEW NORMAL. The technical program will span three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial,...
The 9th ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC 2022) will take place in-person in Sibiu (Hermannstadt), Romania, in less than a month. ESTC is the single largest semiconductor packaging conference in Europe and a premier international event in the field of electronics packaging and system integration. The conference is organized every...
The SEMI Market Intelligence Team (MIT) recently recorded the first podcast in a new series with 3D InCites that will provide semiconductor manufacturing updates across the wafer fab; equipment; materials; and assembly, packaging, and test markets to help semiconductor companies and other key industry stakeholders with their day-to-day business decisions....
Apps natively integrated with the Xcelium Logic Simulator enable users to target domain-specific needs for highest verification performance SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced Xcelium Apps, a portfolio of domain-specific technologies implemented natively on the Cadence® Xcelium™ Logic Simulator kernel that enable automotive, mobile and...
Minneapolis, Minnesota — June 2022 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will exhibit at SEMICON West 2022 HYBRID, scheduled to take place July 12–14, 2022 at the Moscone Center in San Francisco and online 24/7. The company will launch...
BERLIN, June 8, 2022: Atotech, a market leader in advanced electroplating solutions, announced today the sale of its 1,000th horizontal equipment for electrolytic copper plating. The plater, which belongs to the company’s Uniplate product family, will be installed at one of Taiwan’s leading advanced package-substrate and PCB manufacturers. Atotech’s Uniplate Cu18...
