Matches for your search: "hybrid bonding "
Heterogenous integration and AI are currently moving forward hand-in-hand as the demand for greater computing power in theory, reduces the energy and time needed to train models; (although, DeepSeek may now change some of the thinking along these lines). Larger more complex packages are being built to manage the learning...
Bridging the gap: innovations in chiplet interconnect technology Chiplet interconnects begin with small chips – or chiplets – with a well-defined function that can be incorporated with other chiplets into a single package or system Dense interconnections between chiplets ensure fast, high-bandwidth electrical connections. This article discusses both interposer and...
Papers will highlight heterogeneous integration solutions such as hybrid bonding, maskless lithography, and layer transfer technology for advanced packaging applications. EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that new developments in heterogeneous integration enabled by its...
Modern-day applications such as cloud computing, high-performance computing, artificial intelligence (AI), data centers, and future 6G systems are driving the implementation of advanced packaging schemes such as system-in-package (SiP), 3D-stacking, 2.5D-Interposers, and more. These schemes are not only replacing Moore’s law in driving semiconductor performance but at the same time...
A Conversation with the Xperi Hybrid Bonding Team In the world of heterogeneous integration, hybrid bonding — and in particular, Direct Bond Interconnect (DBI®) is quickly becoming the preferred permanent bonding path for forming high-density interconnects in a multitude of applications, from image sensors and MEMS devices, and most recently...
From the cloud to edge computing, the quest for ever-greater power efficiency remains researchers’ top priority. From high-end niche to mass-market applications, the best cost-to-performance tradeoff is key to providing a competitive advantage. While Moore’s Law has helped meet the performance required in terms of data transfer and power efficiency...
At CES 2019, Intel previewed a new client platform, code-named “Lakefield”. It featured the first iteration of its new innovative Foveros 3D packaging technology. The Lakefield stacked module will contain: 10nm hybrid CPU architecture Gen 11 graphics Multiple dies stacked on top of each other The die is then stacked...
Would it be flippant to say that the most pivotal event that impacted the commercialization of 3D integration technologies, may have been the commercialization of 2.5D interposer technologies? Arguably, 3D and silicon interposer are very different technologies, with a common denominator that happens to be the through silicon via (TSV)....
The special Tuesday session at ECTC 2018 took a look at new methods and applications for assembly technology to accommodate the needs of heterogeneous integration at the system level. The session was chaired by Florian Herrault, HRL Laboratories, and featured Jeff Demmin, DARPA; Stefan Behler, Besi; Matthew Meitl, X-celeprint; Doris...
CMOS image sensors (CIS) have often been heralded as the first 3D devices in volume manufacturing. However, this is not really the case. Shellcase MVP, the first generation of CIS that used through silicon vias (TSVs) to form interconnects was still a 2D device. (Remember, TSV is not always synonymous with 3D)....
