3D TSV IP Landscape for Memory Applications: Who Owns What?
The last two years have shown some important changes within the 3D through silicon via (TSV) memory market. First commercial products including 3D stacked (3DS), DDR4, high bandwidth memory (HBM) and hybrid memory cube (HMC) have been released by the microelectronics giants. Then first 3D TSV IP patent litigations took...